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One style of current limiting circuit is shown in the image. The schematic represents a simple protection mechanism used in regulated DC supplies and class-AB power amplifiers. Q1 is the pass or output transistor. R sens is the load current sensing device. Q2 is the protection transistor which turns on as soon as the voltage across R sens ...
For a device that makes use of the secondary breakdown effect see Avalanche transistor. Secondary breakdown is a failure mode in bipolar power transistors. In a power transistor with a large junction area, under certain conditions of current and voltage, the current concentrates in a small spot of the base-emitter junction.
The ULN2003A is an integrated circuit produced by Texas Instruments. It consists of an array of seven NPN Darlington transistors capable of 500 mA, 50 V output. It features common-cathode flyback diodes for switching inductive loads (such as servomotors). It can come in PDIP, SOIC, SOP or TSSOP packaging.
The Semiconductor Chip Protection Act of 1984 (or SCPA) is an act of the US Congress that makes the layouts of integrated circuits legally protected upon registration, and hence illegal to copy without permission. It is an integrated circuit layout design protection law.
Chip-on-board (COB), a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
JTAG (named after the Joint Test Action Group which codified it) is an industry standard for verifying designs of and testing printed circuit boards after manufacture. JTAG implements standards for on-chip instrumentation in electronic design automation (EDA) as a complementary tool to digital simulation . [ 1 ]
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
A resistor removed from a high voltage tube circuit shows damage from voltaic arcing on the resistive metal oxide layer. Resistors can fail open or short, alongside their value changing under environmental conditions and outside performance limits. Examples of resistor failures include: Manufacturing defects causing intermittent problems.