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The Hi-Speed USB logo. USB 2.0 was released in April 2000, adding a higher maximum signaling rate of 480 Mbit/s (maximum theoretical data throughput 53 MByte/s [25]) named High Speed or High Bandwidth, in addition to the USB 1.x Full Speed signaling rate of 12 Mbit/s (maximum theoretical data throughput 1.2 MByte/s). [26]
A deprecated [2] SuperSpeed USB 5 Gbit/s packaging logo. Universal Serial Bus 3.0 (USB 3.0), marketed as SuperSpeed USB, is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. It was released in November 2008.
This logo image consists only of simple geometric shapes or text. It does not meet the threshold of originality needed for copyright protection, and is therefore in the public domain . Although it is free of copyright restrictions, this image may still be subject to other restrictions .
A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [42] to 21.5 V with USB PD 2.0 [43] and 50.9 V with USB PD 3.1, [43] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
USB 3.0 SuperSpeed – host controller (xHCI) hardware support, no software overhead for out-of-order commands; USB 2.0 High-speed – enables command queuing in USB 2.0 drives; Streams were added to the USB 3.0 SuperSpeed protocol for supporting UAS out-of-order completions USB 3.0 host controller (xHCI) provides hardware support for streams