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  2. Vacuum packing - Wikipedia

    en.wikipedia.org/wiki/Vacuum_packing

    Sealed food alongside a home vacuum sealer and plastic rolls used for sealing. Vacuum packing is a method of packaging that removes air from the package prior to sealing. This method involves placing items in a plastic film package, removing air from inside and sealing the package. [1]

  3. List of polyurethane applications - Wikipedia

    en.wikipedia.org/wiki/List_of_polyurethane...

    Exterior use of polyurethane varnish may be problematic due to its susceptibility to deterioration through ultra-violet (UV) light exposure. All clear or translucent varnishes, and indeed all film-polymer coatings (i.e., paint, stain, epoxy, synthetic plastic, etc.) are susceptible to this damage in varying degrees.

  4. Ultra-high vacuum - Wikipedia

    en.wikipedia.org/wiki/Ultra-high_vacuum

    Ultra-high vacuum (often spelled ultrahigh in American English, UHV) is the vacuum regime characterised by pressures lower than about 1 × 10 −6 pascals (1.0 × 10 −8 mbar; 7.5 × 10 −9 Torr). UHV conditions are created by pumping the gas out of a UHV chamber.

  5. These are the best Labor Day vacuum deals from Dyson ... - AOL

    www.aol.com/lifestyle/these-are-the-best-labor...

    These are the top vacuum deals to score during Labor Day, ... Shark AV2501S AI Ultra Robot Vacuum. $330 $550 Save $220. See at Amazon. iRobot Braava Jet M6 (6110) $244 $450 Save $206.

  6. Materials for use in vacuum - Wikipedia

    en.wikipedia.org/wiki/Materials_for_use_in_vacuum

    Austenitic stainless steels are the most common choice for high vacuum and ultra-high vacuum systems. Not all alloys are suitable; e.g. the free-machining 303 steel contains sulfur, which tends to outgas. Alloys with good weldability under argon arc welding are usually chosen. 304 stainless steel is a common choice of a stainless steel.

  7. Surface activated bonding - Wikipedia

    en.wikipedia.org/wiki/Surface_activated_bonding

    Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces.