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Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs.
A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. [1]
In integrated circuit design automation, the term "circuit design" often refers to the step of the design cycle which outputs the schematics of the integrated circuit. Typically this is the step between logic design and physical design. [1]
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (metal oxide semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunications technologies.
Structured ASIC design (also referred to as "platform ASIC design") is a relatively new trend in the semiconductor industry, resulting in some variation in its definition. However, the basic premise of a structured ASIC is that both manufacturing cycle time and design cycle time are reduced compared to cell-based ASIC, by virtue of there being ...
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), [1] is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips.
In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design.At this step, circuit representations of the components (devices and interconnects) of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components.
In integrated circuit (IC) design, a via is a small opening in an insulating oxide layer that allows a conductive connection between different layers. A via on an integrated circuit that passes completely through a silicon wafer or die is called a through-chip via or through-silicon via (TSV).