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The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [17] The adhesion promoter with a specific thickness is deposited, i.e. spin-coated or contact printed on the wafer to improve the bonding strength.
After evaporation of the solvent, a solid compound is formed. Chemical bonds are also important in certain adhesive / substrate combinations, for example when bonding glass using silicone adhesives, wood using polyurethane adhesives and aluminium using epoxy adhesives. Chemical bonding leads to significantly higher adhesion than physical bonding.
The addition of RGD onto a cardiac tissue scaffold has been shown to promote cell adhesion, prevent apoptosis and enhance tissue regeneration. [33] RGD peptide has also been used to improve endothelial cell adhesion and proliferation on synthetic heart valves.
A number of adhesion promotion methods have been developed to enhance PTFE bond strength. The primary methods currently used in industry are sodium etching and plasma etching. Results of ion beam treatment and laser surface roughening have also been reported in the literature, but do not have a significant presence as commercial processes.
By altering the surface functionalities using plasma modification, the optimal surface, chemical and physical properties can be obtained. Plasma immersion implantation is a technique suitable for low melting point materials such as polymers, and widely accepted to improve adhesion between pinhole free layers and substrates.
Certain material selection (i.e. laminate) and design rules (i.e. via spacing) can help reduce CAF risk. Poor adhesion between the resin and glass fibers in the PCB can create a path for CAF to occur. This may depend on parameters of the silane finish applied to the glass fibers, which is used to promote adhesion to the resin. [5]