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Electron-beam lithography systems used in commercial applications are dedicated e-beam writing systems that are very expensive (> US$1M). For research applications, it is very common to convert an electron microscope into an electron beam lithography system using relatively low cost accessories (< US$100K). Such converted systems have produced ...
LIGA consists of three main processing steps: lithography, electroplating, and molding. There are two main LIGA-fabrication technologies: X-Ray LIGA, which uses X-rays produced by a synchrotron to create high-aspect-ratio structures, and UV LIGA, a more accessible method which uses ultraviolet light to create structures with relatively low aspect ratios.
Electron-beam machining is a process in which high-velocity electrons are concentrated into a narrow beam with a very high planar power density. The beam cross-section is then focused and directed toward the work piece, creating heat and vaporizing the material. Electron-beam machining can be used to accurately cut or bore a wide variety of metals.
Contact lithography, also known as contact printing, is a form of photolithography whereby the image to be printed is obtained by illumination of a photomask in direct contact with a substrate coated with an imaging photoresist layer.
Depending on the resist various methods can be used, such as Extreme ultraviolet lithography - EUVL or Electron beam lithography - EBL. The photoresist is removed in the areas, where the target material is to be located, creating an inverse pattern.) Target material (usually a thin metal layer) is deposited (on the whole surface of the wafer).
Multibeam developed miniature, all-electrostatic columns for e-beam lithography, that provide a maskless and high throughput platform for writing nanoscale IC patterns seamlessly across full wafers. Arrays of e-beam columns operate simultaneously and in parallel to increase wafer processing speed.
The primary advantage of electron beam lithography is that it is one of the ways to beat the diffraction limit of light and make features in the nanometer range. This form of maskless lithography has found wide usage in photomask-making used in photolithography, low-volume production of semiconductor components, and research & development. The ...
Proton beam writing (or p-beam writing) is a direct-write lithography process that uses a focused beam of high-energy protons to pattern resist material at nanodimensions. [1] The process, although similar in many ways to direct writing using electrons , nevertheless offers some interesting and unique advantages.