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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A spreadsheet of semiconductor outline dimensions and names, cross-referencing JEDEC, ProElectron, Soviet and commercial packages, past and present. Updated semi-annually. An archived web page with links to package drawing collections of SMD, hermetic, plastic, RF, coaxial and hybrid power module varieties.corresponding to dimensions and names ...

  3. List of semiconductor materials - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).

  4. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.

  5. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    On 17 October 2016, Samsung Electronics announced mass production of SoC chips at 10 nm. [ 121 ] TSMC began commercial production of 10 nm chips in early 2016, before moving onto mass production in early 2017.

  6. Transistor - Wikipedia

    en.wikipedia.org/wiki/Transistor

    The bipolar junction transistor, the first type of transistor to be mass-produced, is a combination of two junction diodes and is formed of either a thin layer of p-type semiconductor sandwiched between two n-type semiconductors (an n–p–n transistor), or a thin layer of n-type semiconductor sandwiched between two p-type semiconductors (a p ...

  7. Substrate mapping - Wikipedia

    en.wikipedia.org/wiki/Substrate_mapping

    Substrate mapping (or wafer mapping) is a process in which the performance of semiconductor devices on a substrate is represented by a map showing the performance as a colour-coded grid. The map is a convenient representation of the variation in performance across the substrate, since the distribution of those variations may be a clue as to ...

  8. JEDEC - Wikipedia

    en.wikipedia.org/wiki/JEDEC

    JEDEC also developed a number of popular package drawings for semiconductors such as TO-3, TO-5, etc. These are on the web under JEP-95. These are on the web under JEP-95. One hot issue is the development of lead-free packages that do not suffer from the tin whiskers problem that reappeared since the recent ban on lead content .

  9. LDMOS - Wikipedia

    en.wikipedia.org/wiki/LDMOS

    LDMOS (laterally-diffused metal-oxide semiconductor) [1] is a planar double-diffused MOSFET (metal–oxide–semiconductor field-effect transistor) used in amplifiers, including microwave power amplifiers, RF power amplifiers and audio power amplifiers. These transistors are often fabricated on p/p + silicon epitaxial layers.