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DDR2 dominated due to cost and support factors. DDR2 was in turn superseded by DDR3 SDRAM, which offered higher performance for increased bus speeds and new features. DDR3 has been superseded by DDR4 SDRAM, which was first produced in 2011 and whose standards were still in flux (2012) with significant architectural changes.
Likewise, 12.8 GB/s transfer rate DDR3-1600 is called PC3-12800. ... DDR2-800, PC2-6400 200 MHz 400 MHz ... DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM;
DDR2 SDRAM was designed with such a scheme to avoid an excessive increase in power consumption. DDR2's bus frequency is boosted by electrical interface improvements, on-die termination, prefetch buffers and off-chip drivers. However, latency is greatly increased as a trade-off. The DDR2 prefetch buffer is four bits deep, whereas it is two bits ...
Early DDR4 samples, such as those from Samsung in January 2011, showed a CAS latency of 13 clock cycles, comparable to the DDR2 to DDR3 transition. Additionally, DDR4 features a longer burst length of 16, higher capacity support, and improved signal integrity with tighter pin spacing (0.85 mm vs. 1.0 mm), slightly increased height (31.25 mm vs ...
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth ("double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips.
Full-height 240-pin DDR2 and DDR3 DIMMs are all specified at a height of around 1.18 inches (30 mm) by standards set by JEDEC. These form factors include 240-pin DIMM, SO-DIMM, Mini-DIMM and Micro-DIMM. [16] Full-height 288-pin DDR4 DIMMs are slightly taller than their DDR3 counterparts at 1.23 inches (31 mm).