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  2. Thermalright Reveals AMD AM5 2-in-1 Secure Frame and Thermal ...

    www.aol.com/thermalright-reveals-amd-am5-2...

    The AM5 Secure Frame is made from a block of aluminum alloy, with black or red finish. It measures 75 x 56 x 7.5mm and weighs 45g. Thermalright bundles it with 2g of its TF7 thermal grease and an ...

  3. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  4. Socket AM5 - Wikipedia

    en.wikipedia.org/wiki/Socket_AM5

    Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [ 2 ] [ 3 ] AM5 was launched in September 2022 and is the successor to AM4 .

  5. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used. More commonly for a personal computer CPU, a clamp holds the heatsink directly over the chip, with a thermal grease or thermal pad spread between. This block has fins and ridges to increase its ...

  6. Socket sTR5 - Wikipedia

    en.wikipedia.org/wiki/Socket_sTR5

    sTR5 is a socket for both Ryzen Threadripper HEDT and Ryzen Threadripper Pro workstation processor lineups. This is unlike the preceding (3000 and 5000 series) generations of Ryzen Threadripper / Threadripper Pro processors, which were on separate sockets, sTRX4 and sWRX8 respectively.

  7. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

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