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The first DDR4 memory module prototype was manufactured by Samsung and announced in January 2011. [a] Physical comparison of DDR, DDR2, DDR3, and DDR4 SDRAM Front and back of 8 GB [1] DDR4 memory modules. 2005: Standards body JEDEC began working on a successor to DDR3 around 2005, [14] about 2 years before the launch of DDR3 in 2007.
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 banks for each bank group for ×16 DRAM. The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed
LPDDR3 went mainstream in 2013, running at 800 MHz DDR (1600 MT/s), offering bandwidth comparable to PC3-12800 notebook memory in 2011 (12.8 GB/s of bandwidth). [11] To achieve this bandwidth, the controller must implement dual-channel memory. For example, this is the case for the Exynos 5 Dual [12] and the 5 Octa. [13]
Samsung Notebook, formerly known as Samsung Sens (삼성 센스), also marketed as Samsung Notebook Series (2011–2013), is a line of portable computers produced by Samsung Electronics. The Sens line was first launched in 1995 and lasted until 2013, exported overseas without the Sens branding, and replaced by Samsung Ativ .
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs [1] and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers ...
Samsung also revealed plans to sample and mass-produce GDDR4 SDRAM rated at 2.8 Gbit/s per pin. [3] In 2005, Hynix developed the first 512-Mbit GDDR4 memory chip. [4] On February 14, 2006, Samsung announced the development of 32-bit 512-Mbit GDDR4 SDRAM capable of transferring 3.2 Gbit/s per pin, or 12.8 GB/s for the module. [5]