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Soldering. Desoldering a contact from a wire. Soldering (US: / ˈsɒdərɪŋ /; UK: / ˈsoʊldərɪŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong ...
Spool of solder, 1.6 mm diameter A soldered joint used to attach a wire to a through-pin of a component on the rear of a printed circuit board (not a customary application of such joints) Solder (UK: / ˈ s ɒ l d ə, ˈ s ə ʊ l d ə /; [1] NA: / ˈ s ɒ d ər /) [2] is a fusible metal alloy used to create a permanent bond between metal ...
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a reliable mechanical and electrical connection.
Solder alloys. Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist ...
Tin-silver-copper. Tin-silver-copper (Sn - Ag - Cu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]