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  2. Current–voltage characteristic - Wikipedia

    en.wikipedia.org/wiki/Current–voltage...

    The current–voltage characteristics of four devices: a resistor with large resistance, a resistor with small resistance, a P–N junction diode, and a battery with nonzero internal resistance. The horizontal axis represents the voltage drop, the vertical axis the current.

  3. p–n diode - Wikipedia

    en.wikipedia.org/wiki/P–n_diode

    A p–n diode is a type of semiconductor diode based upon the p–n junction. The diode conducts current in only one direction, and it is made by joining a p-type semiconducting layer to an n-type semiconducting layer. Semiconductor diodes have multiple uses including rectification of alternating current to direct current, in the detection of ...

  4. p–n junction - Wikipedia

    en.wikipedia.org/wiki/P–n_junction

    p–n junctions represent the simplest case of a semiconductor electronic device; a p-n junction by itself, when connected on both sides to a circuit, is a diode. More complex circuit components can be created by further combinations of p-type and n-type semiconductors; for example, the bipolar junction transistor (BJT) is a semiconductor in ...

  5. Semiconductor device - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device

    A semiconductor diode is a device typically made from a single p–n junction.At the junction of a p-type and an n-type semiconductor, there forms a depletion region where current conduction is inhibited by the lack of mobile charge carriers.

  6. Metal–semiconductor junction - Wikipedia

    en.wikipedia.org/wiki/Metal–semiconductor_junction

    The rectifying metal–semiconductor junction forms a Schottky barrier, making a device known as a Schottky diode, while the non-rectifying junction is called an ohmic contact. [1] (In contrast, a rectifying semiconductor–semiconductor junction, the most common semiconductor device today, is known as a p–n junction.)

  7. Planar process - Wikipedia

    en.wikipedia.org/wiki/Planar_process

    The process involves the basic procedures of silicon dioxide (SiO 2) oxidation, SiO 2 etching and heat diffusion. The final steps involves oxidizing the entire wafer with an SiO 2 layer, etching contact vias to the transistors, and depositing a covering metal layer over the oxide , thus connecting the transistors without manually wiring them ...

  8. Depletion region - Wikipedia

    en.wikipedia.org/wiki/Depletion_region

    A PN junction in forward bias mode, the depletion width decreases. Both p and n junctions are doped at a 1e15/cm3 doping level, leading to built-in potential of ~0.59V. Observe the different Quasi Fermi levels for conduction band and valence band in n and p regions (red curves). A depletion region forms instantaneously across a p–n junction.

  9. Band diagram - Wikipedia

    en.wikipedia.org/wiki/Band_diagram

    At the junction of two different types of the same semiconductor (e.g., p-n junction) the bands vary continuously since the dopants are sparsely distributed and only perturb the system. At the junction of two different semiconductors there is a sharp shift in band energies from one material to the other; the band alignment at the junction (e.g ...