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2. Copper–tungsten - Wikipedia

   en.wikipedia.org/wiki/Copper–tungsten

   The mixture with less wt.% of copper has higher density, higher hardness, and higher resistivity. The typical density of CuW90, with 10% of copper, is 16.75 g/cm 3 and 11.85 g/cm 3 for CuW50 . CuW90 has higher hardness and resistivity of 260 HB kgf/mm 2 and 6.5 μΩ.cm than CuW50. Typical properties of commonly used copper tungsten compositions [1]

3. Electrochemical machining - Wikipedia

   en.wikipedia.org/wiki/Electrochemical_machining

   Electrochemical machining, as a technological method, originated from the process of electrolytic polishing offered already in 1911 by a Russian chemist E. Shpitalsky. [3] As far back as 1929, an experimental ECM process was developed by W.Gussef, although it was 1959 before a commercial process was established by the Anocut Engineering Company.

4. Electrical discharge machining - Wikipedia

   en.wikipedia.org/wiki/Electrical_discharge_machining

   Electrical discharge machining (EDM), also known as spark machining, spark eroding, die sinking, wire burning or wire erosion, is a metal fabrication process whereby a desired shape is obtained by using electrical discharges (sparks). [1]

5. Electrochemical grinding - Wikipedia

   en.wikipedia.org/wiki/Electrochemical_grinding

   Electrochemical grinding is often used for hard materials where conventional machining is difficult and time-consuming, such as stainless steel and some exotic metals. For materials with hardness greater than 65 HRC, ECG can have a material removal rate 10 times that of conventional machining.

6. Electron-beam machining - Wikipedia

   en.wikipedia.org/wiki/Electron-beam_machining

   Electron-beam machining (EBM) is a process where high-velocity electrons concentrated into a narrow beam that are directed towards the work piece, creating heat and vaporizing the material. EBM can be used for very precise cutting or boring of a wide variety of metals.

7. Chemical-mechanical polishing - Wikipedia

   en.wikipedia.org/wiki/Chemical-mechanical_polishing

   Since that time, the integrated circuit industry has moved from aluminum to copper conductors. This required the development of an additive patterning process, which relies on the unique abilities of CMP to remove material in a planar and uniform fashion and to stop repeatably at the interface between copper and oxide insulating layers (see ...