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  2. Heat-shrink tubing - Wikipedia

    en.wikipedia.org/wiki/Heat-shrink_tubing

    Animation of heat-shrink tubing, before and after shrinking. Heat-shrink tubing (or, commonly, heat shrink or heatshrink) is a shrinkable plastic tube used to insulate wires, providing abrasion resistance and environmental protection for stranded and solid wire conductors, connections, joints and terminals in electrical wiring.

  3. MIL-DTL-5015 - Wikipedia

    en.wikipedia.org/wiki/MIL-DTL-5015

    MIL-DTL-5015 is a United States Military Standard which covers heavy-duty circular electrical connectors with soldered or crimped contacts. [1] They are used for both digital and analog signals, as well as power distribution, and are common in various fields, including defense, aerospace, and industrial machinery. [2]

  4. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ...

  5. U.S. Military connector specifications - Wikipedia

    en.wikipedia.org/wiki/U.S._Military_connector...

    A MIL-DTL-38999 circular connector plated with a nickel–teflon composite. Left: plug (male) type connector; Right: receptacle (female) type connector) Electrical or fiber-optic connectors used by U.S. Department of Defense were originally developed in the 1930s for severe aeronautical and tactical service applications, and the Type "AN" series set the standard for modern military circular ...

  6. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Thermally-enhanced shrink small-outline package [15] HTSSOP: Thermally-enhanced thin shrink small-outline package [15] mini-SOIC: Mini small-outline integrated circuit MSOP: Mini small-outline package: Maxim uses the trademarked name μMAX for MSOP packages PSOP: Plastic small-outline package [3] PSON: Plastic small-outline no-lead package: QSOP