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  2. Teslin (material) - Wikipedia

    en.wikipedia.org/wiki/Teslin_(material)

    Teslin grades are referred to as a letter and number designation (e.g. "SP 1000"). The letters are the type of Teslin, and the numbers represent the thickness where 1000 is 10 mil, 600 is 6 mil, 700 is 7 mil, etc.

  3. Thousandth of an inch - Wikipedia

    en.wikipedia.org/wiki/Thousandth_of_an_inch

    The thou, or mil, is most commonly used in engineering and manufacturing in non-metric countries. For example, in specifying: The thickness of items such as paper, film, foil, wires, paint coatings, latex gloves, plastic sheeting, and fibers For example, most plastic ID cards are about 30 thou (0.76 mm) in thickness.

  4. High-density polyethylene - Wikipedia

    en.wikipedia.org/wiki/High-density_polyethylene

    HDPE is known for its high strength-to-density ratio. [4] The density of HDPE ranges from 930 to 970 kg/m 3. [5] Although the density of HDPE is only marginally higher than that of low-density polyethylene, HDPE has little branching, giving it stronger intermolecular forces and tensile strength (38 MPa versus 21 MPa) than LDPE. [6]

  5. Thermoplastic olefin - Wikipedia

    en.wikipedia.org/wiki/ThermoPlastic_Olefin

    Thermoplastic olefin, thermoplastic polyolefin (TPO), or olefinic thermoplastic elastomers refer to polymer/filler blends usually consisting of some fraction of a thermoplastic, an elastomer or rubber, and usually a filler.

  6. Design of plastic components - Wikipedia

    en.wikipedia.org/wiki/Design_of_plastic_components

    Some plastics are more sensitive to wall thickness than others, where acetal and ABS plastics max out at around 0.12 in. thick (3 mm), acrylic can go to 0.5 in. (12 mm), polyurethane to 0.75 in. (18 mm), and certain fiber-reinforced plastics to 1 in. (25 mm) or more.

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil). C Clearance between package body and PCB. H Height of package from pin tip to top of package. T Thickness of pin. L Length of package body only. L W Pin width. L L Pin length from package to pin tip. P Pin pitch (distance between conductors to the PCB). W B Width of ...