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Dip soldering is used for both through-hole printed circuit assemblies, and surface mount. It is one of the cheapest methods to solder and is extensively used in the small scale industries of developing countries . Dip soldering is a manual equivalent of automated wave soldering. The apparatus required is just a small tank containing molten solder.
Resistance soldering is soldering in which the heat required to melt the solder is created by passing an electric current through the parts to be soldered. When electric current is conducted through any metal, heat is generated; when that current is confined to a smaller cross-sectional area, the heat produced in the entire circuit is ...
Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.
Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and populating them with electronic components. It includes all the processes to produce the full assembly of a board into a functional circuit board. In board manufacturing, multiple PCBs are grouped on a single panel for efficient processing.
Soldering flux will help to remove oxide; the more active the flux the better the cleaning, although acidic flux used on circuit boards that is not carefully cleaned off will cause corrosion. A tip which is cleaned but not retinned is susceptible to oxidation. Soldering iron tips are made of a copper core plated various metals including iron.
The paste manufacturer will suggest a suitable reflow temperature profile to suit their individual paste. The main requirement is a gentle rise in temperature to prevent explosive expansion (which can cause "solder balling"), yet activate the flux. Thereafter, the solder melts. The time in this area is known as Time Above Liquidus. A reasonably ...