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  2. Arctic GmbH - Wikipedia

    en.wikipedia.org/wiki/Arctic_GmbH

    Arctic GmbH, formerly known as Arctic Cooling, [1] is a German, Swiss-founded manufacturer of computer cooling components, mainly CPU and graphics card coolers, [2] case fans and thermal compound. Since 2010, Arctic expanded its business by starting a range of products to cater other consumer demands beyond that of computer cooling hardware.

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1).

  4. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Several containers of thermal paste of different brands. From left to right: Arctic Cooling MX-2 and MX-3, Tuniq TX-3, Cool Laboratory Liquid Metal Pro, Shin-Etsu MicroSi G751, Arctic Silver 5, Powdered Diamond. In background: Arctic Silver thermal paste remover.

  5. Arctic Silver - Wikipedia

    en.wikipedia.org/wiki/Arctic_Silver

    Arctic Alumina is a ceramics-based polysynthetic thermal compound using aluminum oxide as a thermal transfer medium. It is a lower-cost product than Arctic Silver 5. [1] The 2009 BenchmarkReviews.com 80-product review rated Alumina in the Good class, with a B+ "enthusiast grade"; [2] it cooled a test system 10% better than the last-place finisher.

  6. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.

  7. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

  8. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  9. Carbon tetrafluoride - Wikipedia

    en.wikipedia.org/wiki/Carbon_tetrafluoride

    Tetrafluoromethane, also known as carbon tetrafluoride or R-14, is the simplest perfluorocarbon (C F 4). As its IUPAC name indicates, tetrafluoromethane is the perfluorinated counterpart to the hydrocarbon methane. It can also be classified as a haloalkane or halomethane. Tetrafluoromethane is a useful refrigerant but also a potent greenhouse ...