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  2. Nickel electroplating - Wikipedia

    en.wikipedia.org/wiki/Nickel_electroplating

    Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]

  3. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  4. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    The electroless deposition and electroplating bath actively performs cathodic and anodic reactions at the surface of the substrate. [2] [3] The standard electrode potential of the metal and reducing agent are important as a driving force for electron exchange. [3] The standard potential is defined as the power of reduction of compounds.

  5. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    The aforementioned electroplating of metals uses an electroreduction process (that is, a negative or cathodic current is on the working electrode). The term "electroplating" is also used occasionally for processes that occur under electro-oxidation (i.e positive or anodic current on the working electrode), although such processes are more ...

  6. Barrel plating - Wikipedia

    en.wikipedia.org/wiki/Barrel_plating

    Barrel plating for electrical components (e.g. ceramic capacitors) used to grow terminals. Barrel plating is a form of electroplating used for plating a large number of smaller metal objects in one sitting. It consists of a non-conductive barrel-shaped cage in which the objects are placed before being subjected to the chemical bath in which ...

  7. Electroless nickel-boron plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel-boron...

    Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...

  8. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress. [16] A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode.

  9. Electrochemical machining - Wikipedia

    en.wikipedia.org/wiki/Electrochemical_machining

    ECM is often characterized as "reverse electroplating", in that it removes material instead of adding it. [2] It is similar in concept to electrical discharge machining (EDM) in that a high current is passed between an electrode and the part, through an electrolytic material removal process involving a cathode tool, electrolytic fluid, and ...