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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Hermes is a machine-to-machine communication standard used in the SMT assembly industry. [1]IPC-HERMES-9852. It is a successor to the SMEMA standard, introducing improvements such as: simpler physical wiring (Ethernet), use of popular data transmission formats (TCP/IP and XML), reduced number of barcode scanners (required only once at the beginning of the line), transmission of board data ...
1A1A44J5 - Unit 1, Assembly 1, Sub-Assembly 44, Jack 5 (J5 is a connector on a box referenced as A44) 1A1A45J333 - Unit 1, Assembly 1, Sub-Assembly 45, Jack 333 (J333 is a connector on a box referenced as A45) A cable connecting these two might be: 1A1W35 - In the assembly A1 is a cable called W35. Connectors on this cable would be designated:
The IPC-NC-349 format is the only IPC standard governing drill and routing formats. [5] XNC is a strict subset of IPC-NC-349, Excellon a big superset. Many indefinite NC files pick some elements of the IPC standard. [1] A digital rights managed copy of the specification is available from the IPC website, for a fee.
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.
This is a list of American Electronic Industries Alliance (EIA) Standards. The EIA ceased operations on February 11, 2011, but the former sectors continue to serve the constituencies of EIA. EIA designated ECA to continue to develop standards for interconnect, passive and electro-mechanical (IP&E) electronic components under the ANSI ...
Environmental stress screening (ESS) refers to the process of exposing a newly manufactured or repaired product or component (typically electronic) to stresses such as thermal cycling and vibration in order to force latent defects to manifest themselves by permanent or catastrophic failure during the screening process.