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Sanitation Standard Operating Procedures is the common name, in the United States, given to the sanitation procedures in food production plants which are required by the Food Safety and Inspection Service of the USDA and regulated by 9 CFR part 416 in conjunction with 21 CFR part 178.1010.
A standard operating procedure (SOP) is a set of step-by-step instructions compiled by an organization to help workers carry out routine operations. [1] SOPs aim to achieve efficiency, quality output, and uniformity of performance, while reducing miscommunication and failure to comply with industry regulations.
Example checklist. While the check sheets discussed above are all for capturing and categorizing observations, the checklist is intended as a mistake-proofing aid when carrying out multi-step procedures, particularly during the checking and finishing of process outputs. This type of check sheet consists of the following:
There are typically several volumes, including supplements for weapons systems, performance charts, servicing checklist, and post maintenance functional checkflight checklist. Pocket checklists (or "PCL") contain pertinent extracts from the main publications necessary to normal operations, emergency procedures, and training.
Download as PDF; Printable version; In other projects Wikidata item; Appearance. move to sidebar hide. SSOP may refer to: Sanitation Standard Operating Procedures ...
A functional specification (also, functional spec, specs, functional specifications document (FSD), functional requirements specification) in systems engineering and software development is a document that specifies the functions that a system or component must perform (often part of a requirements specification) (ISO/IEC/IEEE 24765-2010).
Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65 mm (0.0256 inches) or 0.635 mm (0.025 inches ). [4] 0.5 mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP.
The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.