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Epoxy adhesives are better in heat and chemical resistance than other common adhesives. In general, epoxy adhesives cured with heat will be more heat- and chemical-resistant than those cured at room temperature. The strength of epoxy adhesives is degraded at temperatures above 350 °F (177 °C). [48]
Liquid optically-clear adhesive (LOCA) is liquid-based bonding technology used in touch panels and display devices to bind the cover lens, plastic, or other optical materials to the main sensor unit or each other. These adhesives improve optical characteristics and durability.
The disadvantage of the lack of instantaneous bonding exhibited by many adhesives can be overcome by using a suitable fast-curing adhesive or a combination of a standard adhesive with a second, fast-curing adhesive (e.g. double-sided adhesive tape) or with another joining method, such as spot welding, rivets, screws, or clinching / press ...
The mixture sets in 4-6 hours and fully cures in up to 15 hours. It can be used as an adhesive, laminate, plug, filler, sealant, or electrical insulator and can be drilled, ground, tapped, machined, sanded, and painted when cured. J-B Kwik is a faster-curing two-part epoxy with medium-temperature resistance up to 300 °F (149 °C).
UV curing is a low-temperature, high speed, and solventless process as curing occurs via polymerization. [2] Originally introduced in the 1960s, this technology has streamlined and increased automation in many industries in the manufacturing sector.
The bonding temperature is lower than with most other HMAs, only about 50 °C (122 °F) to 70 °C (158 °F), when the adhesive behaves as a soft rubber acting as a pressure-sensitive adhesive. The surface wetting in this amorphous state is good, and on cooling the polymer crystallizes, forming a strong flexible bond with high cohesion.