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2. Sizzix - Wikipedia

   en.wikipedia.org/wiki/Sizzix

   Sizzix is the brand name of a product range of home die-cutting machines and embossing machines manufactured by Ellison. [1] The machines are used for cutting materials such as paper, fabric, vellum, metal and other materials that scissors can cut. [ 2 ]

3. Die (manufacturing) - Wikipedia

   en.wikipedia.org/wiki/Die_(manufacturing)

   The cutting surface of the die is the edge of hardened steel strips, known as steel rule. These steel rules are usually located using saw or laser-cut grooves in plywood. The mating die can be a flat piece of hardwood or steel, a male shape that matches the workpiece profile, or it can have a matching groove that allows the rule to nest into ...

4. Die (integrated circuit) - Wikipedia

   en.wikipedia.org/wiki/Die_(integrated_circuit)

   A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography .

5. Die cutting (web) - Wikipedia

   en.wikipedia.org/wiki/Die_cutting_(web)

   Rotary die cutting is die cutting using a cylindrical die on a rotary press and may be known as a rotary die cutter or RDC. A long sheet or web of material will be fed through the press into an area known as a "station" which holds a rotary tool that will cut out shapes, make perforations or creases, or even cut the sheet or web into smaller parts.

6. Die cutting - Wikipedia

   en.wikipedia.org/wiki/Die_cutting

   Die cutting may refer to: Die (manufacturing) Die cutting (shearing), the general process of shearing using dies; Die cutting (web), the cutting of shapes out of webs; Die preparation of semiconductor chips; Another name for die making; Katanuki (Japanese, lit. Die Cutting), a game where one cuts a shape out of a sheet of candy

7. Die preparation - Wikipedia

   en.wikipedia.org/wiki/Die_preparation

   Wafer glued on blue tape and cut into pieces, with some individual dies removed. Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.