Search results
Results From The WOW.Com Content Network
How fast self-discharge in a battery occurs is dependent on the type of battery, state of charge, charging current, ambient temperature and other factors. [2] Primary batteries are not designed for recharging between manufacturing and use, and thus to be practical they must have much lower self-discharge rates than older types of secondary cells.
An active laptop cooler. A laptop/notebook cooler, cooling pad, cooler pad or chill mat is an accessory for laptop computers intended to reduce their operating temperature when the laptop is unable to sufficiently cool itself. Laptop coolers are intended to protect both the laptop from overheating and the user from suffering heat related ...
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating ...
A review by the Tech Report of the pre-production 2012-vintage NUC found that the NUC would seize up after a few gigabytes were transferred over wireless and that the problem could be alleviated by better cooling of the NUC case. Intel later increased the default fan speed for production machines through a BIOS update (downloadable from Intel's ...
When the battery fails, BIOS settings are reset to their defaults. The battery can also be used to power a real time clock (RTC) and the RTC, NVRAM and battery may be integrated into a single component. The name CMOS memory comes from the technology used to make the memory, which is easier to say than NVRAM. [3]
Hence, once we know the thermal power to be dissipated (Pd), the maximum allowed case temperature (Tc) of the CPU and the maximum expected ambient temperature (Ta) of the air entering the cooling fans, we can determine the fundamental characteristics of the required Heat sink, i.e. its thermal resistance Rca, as:
These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the ...