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  2. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    This is done by bending the existing leads on resistors, capacitors, etc. into position, trimming off extra length, and soldering the lead to make the required electrical connection. Another school of thought refuses to bend the excess leads of components and use them for wiring, on the grounds that this makes removing a component later hard or ...

  3. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process.

  5. Component placement - Wikipedia

    en.wikipedia.org/wiki/Component_placement

    Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

  6. Potting (electronics) - Wikipedia

    en.wikipedia.org/wiki/Potting_(electronics)

    When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...

  7. Dip soldering - Wikipedia

    en.wikipedia.org/wiki/Dip_soldering

    Dip soldering apparatus. Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a mechanical and electrical connection.

  8. Point-to-point construction - Wikipedia

    en.wikipedia.org/wiki/Point-to-point_construction

    Even after the introduction of printed circuit boards, it did not require laying out and manufacturing circuit boards. Point-to-point and terminal strip construction continued to be used for some vacuum tube equipment even after the introduction of printed circuit boards. The heat of the tubes can degrade the circuit boards and cause them to ...

  9. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...