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  2. Failure of electronic components - Wikipedia

    en.wikipedia.org/wiki/Failure_of_electronic...

    Electrostatic discharge (ESD) is a subclass of electrical overstress and may cause immediate device failure, permanent parameter shifts and latent damage causing increased degradation rate. It has at least one of three components, localized heat generation, high current density and high electric field gradient; prolonged presence of currents of ...

  3. Bent pin analysis - Wikipedia

    en.wikipedia.org/wiki/Bent_Pin_Analysis

    For example, a failure mode might be listed on the FMEA worksheet as “Pin A shorts Pin K,” and the corresponding local level failure effect might be “Input Signal X shorts Signal Y normal path.” (Here, bent Pin A carries Signal X and undamaged Pin K carries Signal Y.) Note that the failure mode “Pin A shorts Pin K” is very different ...

  4. Electrical fault - Wikipedia

    en.wikipedia.org/wiki/Electrical_fault

    In an electric power system, a fault or fault current is any abnormal electric current. For example, a short circuit is a fault in which a live wire touches a neutral or ground wire. An open-circuit fault occurs if a circuit is interrupted by a failure of a current-carrying wire (phase or neutral) or a blown fuse or circuit breaker.

  5. Conductive anodic filament - Wikipedia

    en.wikipedia.org/wiki/Conductive_anodic_filament

    CAF commonly occurs between adjacent vias (i.e. plated through holes) inside a PCB, as the copper migrates along the glass/resin interface from anode to cathode.CAF failures can manifest as current leakage, intermittent electrical shorts, and even dielectric breakdown between conductors in printed circuit boards. [3]

  6. Worst-case circuit analysis - Wikipedia

    en.wikipedia.org/wiki/Worst-case_circuit_analysis

    In addition to a circuit analysis, a WCCA often includes stress and derating analysis, failure modes and effects criticality and reliability prediction . The specific objective is to verify that the design is robust enough to provide operation which meets the system performance specification over design life under worst-case conditions and ...

  7. Solder fatigue - Wikipedia

    en.wikipedia.org/wiki/Solder_fatigue

    Solder is a metal alloy used to form electrical, thermal, and mechanical interconnections between the component and printed circuit board (PCB) substrate in an electronic assembly. Although other forms of cyclic loading are known to cause solder fatigue, it has been estimated that the largest portion of electronic failures are ...

  8. Failure cause - Wikipedia

    en.wikipedia.org/wiki/Failure_cause

    They include corrosion, welding of contacts due to an abnormal electric current, return spring fatigue failure, unintended command failure, dust accumulation and blockage of mechanism, etc. Seldom only one cause (hazard) can be identified that creates system failures. The real root causes can in theory in most cases be traced back to some kind ...

  9. Intermittent fault - Wikipedia

    en.wikipedia.org/wiki/Intermittent_fault

    A simple example of an effectively random cause in a physical system is a borderline electrical connection in the wiring or a component of a circuit, where (cause 1, the cause that must be identified and rectified) two conductors may touch subject to (cause 2, which need not be identified) a minor change in temperature, vibration, orientation ...