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[12] [13] The invention of the MOSFET enabled the practical use of metal–oxide–semiconductor (MOS) transistors as memory cell storage elements, a function previously served by magnetic cores. [14] The first modern memory cells were introduced in 1964, when John Schmidt designed the first 64-bit p-channel MOS static random-access memory (SRAM).
The advent of the metal–oxide–semiconductor field-effect transistor (MOSFET), [12] invented by Mohamed M. Atalla and Dawon Kahng at Bell Labs in 1959, [13] enabled the practical use of metal–oxide–semiconductor (MOS) transistors as memory cell storage elements, a function previously served by magnetic cores in computer memory. [12]
It was the fourth member of the IBM System/370 line of computers, [a] and was the first IBM computer to use semiconductor memory for its main memory instead of magnetic core memory. [4] It was described as being five times faster than the IBM System/360 Model 40. First shipments were scheduled for late summer of 1971. [1]
Mosys uses a single-transistor storage cell (bit cell) like dynamic random-access memory (DRAM), but surrounds the bit cell with control circuitry that makes the memory functionally equivalent to SRAM (the controller hides all DRAM-specific operations such as precharging and refresh). 1T-SRAM (and PSRAM in general) has a standard single-cycle ...
SanDisk X4 flash memory cards, introduced in 2009, was one of the first products based on NAND memory that stores 4 bits per cell, commonly referred to as quad-level-cell (QLC), using 16 discrete charge levels (states) in each individual transistor. The QLC chips used in these memory cards were manufactured by Toshiba, SanDisk and SK Hynix. [30 ...
An illustration of the write amplification phenomenon in flash-based storage devices. Over time, advancements in central processing unit (CPU) speed has driven innovation in secondary storage technology. [7] One such innovation, flash memory, is a non-volatile storage medium that can be electrically erased and reprogrammed.
A memory device is built from a grid of such "cells". The simplest method of reading is accomplished by measuring the electrical resistance of the cell. A particular cell is (typically) selected by powering an associated transistor that switches current from a supply line through the cell to ground.
The 1T-1C storage cell design in a FeRAM is similar in construction to the storage cell in DRAM, in that both cell types include one capacitor and one access transistor. In a DRAM cell capacitor, a linear dielectric is used, whereas in a FeRAM cell capacitor the dielectric structure includes ferroelectric material , typically lead zirconate ...