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  2. Hermetic seal - Wikipedia

    en.wikipedia.org/wiki/Hermetic_seal

    A hermetic seal is any type of sealing that makes a given object airtight (preventing the passage of air, oxygen, or other gases). The term originally applied to airtight glass containers, but as technology advanced it applied to a larger category of materials, including rubber and plastics.

  3. Glass frit bonding - Wikipedia

    en.wikipedia.org/wiki/Glass_frit_bonding

    Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. [1] This technique utilizes low melting-point glass ("glass solder") and ...

  4. Ferrofluidic seal - Wikipedia

    en.wikipedia.org/wiki/Ferrofluidic_seal

    Ferrofluidic is the brand name of a staged magnetic liquid rotary sealing mechanism made by the Ferrotec Corporation. Ferrofluidic seals, also known as magnetic liquid rotary seals, are employed in various rotating equipment to facilitate rotary motion while ensuring a hermetic seal. This is achieved through a physical barrier constituted by a ...

  5. Metal bellows - Wikipedia

    en.wikipedia.org/wiki/Metal_bellows

    Metal bellows. Metal bellows are elastic vessels that can be compressed when pressure is applied to the outside of the vessel, or extended under vacuum. When the pressure or vacuum is released, the bellows will return to its original shape, provided the material has not been stressed past its yield strength. They are used both for their ability ...

  6. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    Semiconductor package. A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting ...

  7. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding using a BCB intermediate layer is a possible method for packaging and sealing of MEMS devices, also structured Si wafers. Its use is specified for applications that does not require hermetic sealing, i.e. MOEMS mirror arrays, RF MEMS switches and tunable capacitors.

  8. Anodic bonding - Wikipedia

    en.wikipedia.org/wiki/Anodic_bonding

    Anodic bonding is a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer; it is commonly used to seal glass to silicon wafers in electronics and microfluidics. This bonding technique, also known as field assisted bonding or electrostatic sealing, [1] is mostly used for connecting silicon ...

  9. Amada Miyachi America - Wikipedia

    en.wikipedia.org/wiki/Amada_Miyachi_America

    Amada Weld Tech is an Amada Group Company. It is headquartered in Isehara, Kanagawa, Japan and develops, manufactures, sells, and services products and systems for metal sheet processing, metal cutting, pressing, and machine tooling. The company was established in 1946 and is listed on the Tokyo Stock Exchange (6113:Tokyo).