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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...

  3. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead. Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison.

  4. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    These handling difficulties prompted development of alternative SMT packages for common MELF components (like diodes) where the power handling capability needed to be similar to MELF components (superior to low-power 0805/0603, etc. SMT components) but with improved automated pick-and-place handling characteristics. [3]

  5. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, [citation needed] thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications.

  6. Quad flat package - Wikipedia

    en.wikipedia.org/wiki/Quad_Flat_Package

    Some QFP packages have an exposed pad. The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. The pad is typically 10 or more mm 2, and with the pad soldered down onto the ground plane, heat is passed into the PCB. This exposed pad also gives a solid ground ...

  7. Thin small outline package - Wikipedia

    en.wikipedia.org/wiki/Thin_small_outline_package

    TSOP48 type I: Silicon Storage Technology 39F1601 TSOP54 type 2 Winbond W982516BH75L TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side.

  8. TO-263 - Wikipedia

    en.wikipedia.org/wiki/TO-263

    The Double Decawatt Package, [1] [2] D2PAK, SOT404 or DDPAK, standardized as TO-263, [3] is a semiconductor package type intended for surface mounting on circuit boards.The TO-263 is designed by Motorola.

  9. Roland Octapad - Wikipedia

    en.wikipedia.org/wiki/Roland_Octapad

    The first model, introduced in 1985, was the Pad-8. Originally to be called MPC-8 (MIDI Percussion Controller 8), but was renamed Pad-8 to avoid legal implications with MPC Electronics. [ 2 ] It was an influential device at that time, allowing drummers and percussionists the opportunity to trigger virtually any MIDI sound source without the ...