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  2. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    The TDP of a CPU has been underestimated in some cases, leading to certain real applications (typically strenuous, such as video encoding or games) causing the CPU to exceed its specified TDP and resulting in overloading the computer's cooling system. In this case, CPUs either cause a system failure (a "therm-trip") or throttle their speed down ...

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    The dust buildup on this laptop CPU heatsink after three years of use has made the laptop unusable due to frequent thermal shutdowns. In operation, the temperature of a computer's components will rise until the heat transferred to the surroundings is equal to the heat produced by the component, that is, when thermal equilibrium is reached. For ...

  4. Computer fan - Wikipedia

    en.wikipedia.org/wiki/Computer_fan

    Some ATX tower cases have one or more additional vents and mounting points in the left side panel where one or more fans may be installed to blow cool air directly onto the motherboard components and expansion cards, which are among the largest heat sources. Standard axial case fans are 40, 60, 80, 92, 120, 140, 200 and 220 mm in width and length.

  5. Gaming computer - Wikipedia

    en.wikipedia.org/wiki/Gaming_computer

    A gaming computer, also known as a gaming PC, is a specialized personal computer designed for playing PC games at high standards. They typically differ from mainstream personal computers by using high-performance graphics cards , a high core-count CPU with higher raw performance and higher-performance RAM .

  6. List of Intel processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_processors

    An iterative refresh of Raptor Lake-S desktop processors, called the 14th generation of Intel Core, was launched on October 17, 2023. [1] [2]CPUs in bold below feature ECC memory support when paired with a motherboard based on the W680 chipset according to each respective Intel Ark product page.

  7. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]

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  9. LGA 1150 - Wikipedia

    en.wikipedia.org/wiki/LGA_1150

    LGA 1150, [1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.