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  2. List of semiconductor materials - Wikipedia

    en.wikipedia.org/.../List_of_semiconductor_materials

    A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).

  3. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]

  4. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Copper wire has become one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications. Copper is used for fine wire ball bonding in sizes from 10 micrometers (0.00039 in) up to 75 micrometers (0.003 in). [ 6 ]

  5. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A basic PCB consists of a flat sheet of insulating material and a layer of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conducting lines called tracks or circuit traces , pads for connections, vias to pass connections between layers of copper, and features such as solid conductive areas for ...

  6. Contact pad - Wikipedia

    en.wikipedia.org/wiki/Contact_pad

    They are often made of gold, copper, or aluminum and measure mere micrometres wide. Pads are positioned on the edges of die, to facilitate connections without shorting. Contact pads exist to provide a larger surface area for connections to a microchip or PCB, allowing for the input and output of data and power.

  7. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  8. Semiconductor - Wikipedia

    en.wikipedia.org/wiki/Semiconductor

    A few of the properties of semiconductor materials were observed throughout the mid-19th and first decades of the 20th century. The first practical application of semiconductors in electronics was the 1904 development of the cat's-whisker detector, a primitive semiconductor diode used in early radio receivers.

  9. Lead (electronics) - Wikipedia

    en.wikipedia.org/wiki/Lead_(electronics)

    The lead wire is a coated copper wire, a tinned copper wire or another electrically conductive wire used to connect two locations electrically. In electronics, a lead (/ ˈ l iː d /) or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically.

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