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Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen (including Zen+, Zen 2 and Zen 3) and Excavator microarchitectures. [ 1 ] [ 2 ] AM4 was launched in September 2016 and was designed to replace the sockets AM3+ , FM2+ and FS1b as a single platform.
Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated GCN 5th generation GPU. Fabrication process: TSMC 7FF.
Socket F: 130 Athlon 64: Clawhammer 1 2000–2600 800 HT 1024 Socket 754: DDR: MMX, 3DNow!+, SSE, SSE2: Cool'n'Quiet: AMD64, NX Bit (not in CG stepping) 1000 HT Socket 939: Newcastle 1800–2400 800 HT 512 Socket 754: AMD64, NX Bit: 1000 HT Socket 939: 90 Winchester 1800–2200 Socket 939: Venice 1800–2400 800 HT Socket 754: DDR2: MMX, 3DNow ...
The Sempron is a name used for AMD's low-end CPUs, replacing the Duron processor. The name was introduced in 2004, and processors with this name continued to be available for the FM2/FM2+ socket in 2015.
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]