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Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry . Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding.
While the national wiring regulations for buildings of many countries follow the IEC 60364 terminology, in North America (United States and Canada), the term "equipment grounding conductor" refers to equipment grounds and ground wires on branch circuits, and "grounding electrode conductor" is used for conductors bonding an earth/ground rod ...
The resulting weld is quite different in appearance from the ball bond, and is referred to as the wedge bond, tail bond, or simply as the second bond. In the final step the machine pays out a small length of wire and tears the wire from the surface using a set of clamps. This leaves a small tail of wire hanging from the end of the capillary ...
Electrical bonding is the practice of intentionally electrically connecting all exposed metal items not designed to carry electricity in a room or building as protection from electric shock. Bonding is also used to minimize electrical arcing between metal surfaces with electrical potential differences.
Other bonding means between different metallic parts and pieces might employ brackets, clamps, exothermic bonds or welds to make effective connections. Effectively bonded equipment can also safely conduct phase-to-ground fault currents, induced currents, surge currents, lightning currents or transient currents during abnormal conditions.
A pipe clamp is a type of clamp often employed in piping, woodworking, and cabinet shops. Pipe clamps for woodwork or cabinet shops are usually composed of commercially manufactured clamp heads or "jaws" and a length of common threaded pipe. [1] [2] The capacity of the clamp is determined by the length of the pipe used.
Long-distance electromagnetic telegraph systems from 1820 onwards [a] used two or more wires to carry the signal and return currents. It was discovered by German scientist C.A. von Steinheil in 1836–1837, that the ground could be used as the return path to complete the circuit, making the return wire unnecessary. [2]
Figure 1. Compliant bonding a gold wire (Click to enlarge view) Figure 2. Solid-state/wire bonding bonding a gold wire with a hard faced bonding tool. Compliant bonding is used to connect gold wires to electrical components such as integrated circuit "chips". It was invented by Alexander Coucoulas in the 1960s. [1]