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Oxygen cleaning may be required for concentrations as low as 23% [3] Other common specifications for oxygen cleaning include ASTM G93 and CGA G-4.1. [ 4 ] Cleaning agents used range from heavy-duty industrial solvents and detergents such as liquid freon , trichlorethylene and anhydrous trisodium phosphate , followed by rinsing in deionised water .
Hypoxic air is to be considered clean air and not contaminated air when assessing oxygen depletion hazards. Information relating access to the protected areas i.e. oxygen-reduced atmosphere are illustrated: AI, Arbeitsinspektorat; SUVA, Schweizerische Unfallversicherungsanstalt; DGUV, Deutsche Gesetzliche Unfallversicherung;
An oxygen sensor (or lambda sensor, where lambda refers to air–fuel equivalence ratio, usually denoted by λ) or probe or sond, is an electronic device that measures the proportion of oxygen (O 2) in the gas or liquid being analyzed. [1] It was developed by Robert Bosch GmbH during the late 1960s under the supervision of Günter Bauman. [1]
Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. Gases such as argon and oxygen , as well as mixtures such as air and hydrogen/nitrogen are used.
The system can be flushed with an inert gas to reduce the concentration of oxygen so that when the flammable gas is admitted, an ignitable mixture cannot form. In NFPA 56, [1] this is known as purge-into-service. In combustion engineering terms, the admission of inert gas dilutes the oxygen below the limiting oxygen concentration.
Some oxygen sensing instruments have the ability to give an alarm signal or close down the welding operation, when there is an unwanted rise in oxygen level. [17] Purging can continue until the oxygen level is low enough once more and welding can begin again. To avoid such situations, undesirable materials must be kept away from the weld zone.
These techniques prevent the compounds from reacting with components of air, usually water and oxygen; less commonly carbon dioxide and nitrogen. A common theme among these techniques is the use of a fine (10 0 –10 −3 Torr) or high (10 −3 –10 −6 Torr) vacuum to remove air, and the use of an inert gas: preferably argon, but often nitrogen.
The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.