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Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...
After curing an artificial wafer containing a mold frame around the dies for carrying additional interconnect elements is created. After the build of the artificial wafer (the so-called reconstitution) the electrical connections from the chip pads to the interconnects are made in thin-film technology, as for any other classical wafer level package.
Orbotech also owned Newport, Wales, UK-based SPTS Technologies Ltd, a manufacturer of etch, PVD and CVD wafer processing equipment for the MEMS, advanced packaging, LED, high-speed RF, and power management devices. [23] On January 10, 2019, KLA-Tencor announced that they were changing their name to KLA Corporation. [24]
Electropolishing, also known as electrochemical polishing, anodic polishing, or electrolytic polishing (especially in the metallography field), is an electrochemical process that removes material from a metallic workpiece, reducing the surface roughness by levelling micro-peaks and valleys, improving the surface finish.
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...