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  2. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...

  3. Chemical-mechanical polishing - Wikipedia

    en.wikipedia.org/wiki/Chemical-mechanical_polishing

    The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...

  4. KLA Corporation - Wikipedia

    en.wikipedia.org/wiki/KLA_Corporation

    Orbotech also owned Newport, Wales, UK-based SPTS Technologies Ltd, a manufacturer of etch, PVD and CVD wafer processing equipment for the MEMS, advanced packaging, LED, high-speed RF, and power management devices. [23] On January 10, 2019, KLA-Tencor announced that they were changing their name to KLA Corporation. [24]

  5. Lapping - Wikipedia

    en.wikipedia.org/wiki/Lapping

    Lapping machine. Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using a machine.. Lapping often follows other subtractive processes with more aggressive material removal as a first step, such as milling and/or grinding.

  6. Non-contact wafer testing - Wikipedia

    en.wikipedia.org/wiki/Non-contact_wafer_testing

    The wafer is lifted by the wafer prober until metal pads on one or more ICs on the wafer make physical contact with the probes. A certain amount of over-travel is required after the first probe makes contact with the wafer, for two reasons: to guarantee that all probes have made contact (to account for non-planarity of the wafer)

  7. Siltronic - Wikipedia

    en.wikipedia.org/wiki/Siltronic

    Initially 150 mm wafers were produced there, then later on the production of 200 mm wafers began. [4] The company was renamed as a stock corporation (Wacker Siltronic AG) in 1996. In 1999, Wacker Siltronic Singapore Pte Ltd opened its 200 mm wafer production plant in Singapore. [2] [5] In 2004, the company changed its name to Siltronic AG. [6]