Ad
related to: motorola pin grid array pga
Search results
Results From The WOW.Com Content Network
Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...
144-Pin Ceramic Quad Flat Pack (CQFP) or 145-Pin Plastic Pin Grid Array (PGA) ... The MC68340 is one of a series of components in Motorola's M68300 Family. Other ...
Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder. Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
But doing so would also demand a much higher total pin count. By the early 1980s, similar limitations on all modern CPU designs led to the introduction of the pin grid array that replaced the DIP. For the new project, Motorola selected a 169-pin layout, giving them plenty of room to work with. The design ultimately used only 114 of them.
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
The Motorola 68000 series (also known as 680x0, m68000, m68k, or 68k) is a family of 32-bit complex instruction set computer (CISC) microprocessors. During the 1980s and early 1990s, they were popular in personal computers and workstations and were the primary competitors of Intel 's x86 microprocessors.
However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8] Ball grid array (BGA) packages have existed since the 1970s, but evolved into flip-chip ball grid array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types.
Socket 370 then became Intel's main desktop socket from late 1999 to late 2000 for 100/133 MHz FSB FC-PGA Coppermine Pentium IIIs. In 2001, the FC-PGA2 Tualatin Pentium III processors brought changes to the infrastructure which required dedicated Tualatin-compatible motherboards; some manufacturers would indicate this with a blue (instead of ...