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A ceramic pin grid array (CPGA) is a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with pins arranged in a pin grid array. Some CPUs that use CPGA packaging are the AMD Socket A Athlons and the Duron.
Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder. Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors (derived from the Mobile Athlon XP).
The next big innovation was the area array package, which places the interconnection terminals throughout the surface area of the package, providing a greater number of connections than previous package types where only the outer perimeter is used. The first area array package was a ceramic pin grid array package. [1]
Ceramic Pin Grid Array (CPGA) Organic Pin Grid Array (OPGA) Contacts: 940: FSB frequency: 200 MHz System clock 1 GHz HyperTransport 2.0: Processors: Athlon 64 Athlon 64 X2 Athlon 64 FX Opteron Sempron Phenom: Predecessor: Socket 939: Successor: AM2+
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
The PA-7100 is packaged in a 504-pin ceramic pin grid array that has a copper-tungsten heat spreader. An improved PA-7100, the PA-7150 was introduced in 1994. It operated at 125 MHz, due to improved circuit design. It was fabricated in the same CMOS26B process as the PA-7100.
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