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A microlens array used in a spectrograph. A microlens is a small lens, generally with a diameter less than a millimetre (mm) and often as small as 10 micrometres (μm). The small sizes of the lenses means that a simple design can give good optical quality but sometimes unwanted effects arise due to optical diffraction at the small features.
A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...
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Its widespread use is due to the wide range of electron beam systems available accessing an equally wide range of electron beam energies (~10 eV to ~100 keV). This is already being used in wafer-level production at eASIC, which uses conventional direct-write electron beam lithography to customize a single via layer for low-cost production of ASICs.
However, [clarification needed] the depth of focus, or tolerance in wafer topography flatness, is improved compared to the corresponding "dry" tool at the same resolution. [ 4 ] The idea for immersion lithography was patented in 1984 by Takanashi et al. [ 5 ] It was also proposed by Taiwanese engineer Burn J. Lin and realized in the 1980s. [ 6 ]
Modern cleanrooms use automated, robotic wafer track systems to coordinate the process. [12] The procedure described here omits some advanced treatments, such as thinning agents. [13] The photolithography process is carried out by the wafer track and stepper/scanner, and the wafer track system and the stepper/scanner are installed side by side.