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For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
"Hard soldering" or "silver soldering" is used to join precious and semi-precious metals such as gold, silver, brass, and copper. The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F).
One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.
Pure metal. Rarely used due to high melting point. Used for joining molybdenum and tungsten for high-temperature applications. 100: Ti 100: pure 1670 – Pure metal. 100: Fe 40 Ni 38 B 18 Mo 4 – Amorphous metal. For brazing and soft magnetic applications. Crystallization at 410 °C. Maximum service temperature 125 °C. [97] 4: 40: 38: 18: Ti ...
Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (T mp = 456 K) at 115 °C would have comparable mechanical properties to copper (T mp = 1358 K) at 881 °C, because they would both be at 0.85T mp despite being at ...