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Initially, GDSII was designed as a stream format used to control integrated circuit photomask plotting. Despite its limited set of features and low data density, it became the industry conventional stream format for transfer of IC layout data between design tools of different vendors, all of which operated with proprietary data formats.
AXIe was targeted for general-purpose instrumentation and semiconductor test. AXIe is based on standards from AdvancedTCA (ATCA), PXI , LAN eXtensions for Instrumentation (LXI), and Interchangeable Virtual Instruments (IVI).
Open Artwork System Interchange Standard (OASIS [3]) is a binary file format used for specification of data structures for photomask production. [4] It's used to represent a pattern an interchange and encapsulation format for hierarchical integrated circuit mask layout information produced during integrated circuit design that is further used for manufacturing of a photomask.
However, these specifications do not include details on the data link layer. In March 2008, SMSC (formerly OASIS SiliconSystems), inventor of the first MOST NIC, and Harman/Becker announced that they would open and license their proprietary data link layer intellectual property to other semiconductor companies on a royalty-bearing basis.
Dragonfly - Embedded test IP insertion tool for logic, memory and mixed-signal testing; Silicon Insight - Interactive program that works with 3rd party testers for controlling and logging of data on the device for at-speed testing; Yield Insight - Yield analysis program which looks at foundry and performance data to diagnose possible problems
Mask data preparation (MDP), also known as layout post processing, is the procedure of translating a file containing the intended set of polygons from an integrated circuit layout into set of instructions that a photomask writer can use to generate a physical mask. Typically, amendments and additions to the chip layout are performed in order to ...
Image source: The Motley Fool. Taiwan Semiconductor Manufacturing (NYSE: TSM) Q4 2024 Earnings Call Jan 16, 2025, 1:00 a.m. ET. Contents: Prepared Remarks. Questions and Answers
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), [1] is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips.