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Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
The heat flow can be modelled by analogy to an electrical circuit where heat flow is represented by current, temperatures are represented by voltages, heat sources are represented by constant current sources, absolute thermal resistances are represented by resistors and thermal capacitances by capacitors.
A heat sink design must fulfill both its thermal as well as its mechanical requirements. Concerning the latter, the component must remain in thermal contact with its heat sink with reasonable shock and vibration. The heat sink could be the copper foil of a circuit board, or a separate heat sink mounted onto the component or circuit board.
Circuits operate more slowly at high temperatures, and have reduced reliability and shorter lifetimes. Heat sinks and other cooling devices and methods are now required for many integrated circuits including microprocessors. Power MOSFETs are at risk of thermal runaway. As their on-state resistance rises with temperature, if the load is ...
Fairchild Semiconductor's Quad-MOSFET Solution Boosts Efficiency and Eliminates Heat Sinking in Active Bridge Applications Four 60V MOSFETs in a Single Package Increases System Efficiency, ...
Temperature increase becomes relevant for relatively small-cross-sections wires, where it may affect normal semiconductor behavior. Besides, since the generation of heat is proportional to the frequency of operation for switching circuits, fast computers have larger heat generation than slow ones, an undesired effect for chips manufacturers.
Junction temperature, short for transistor junction temperature, [1] is the highest operating temperature of the actual semiconductor in an electronic device. In operation, it is higher than case temperature and the temperature of the part's exterior.
Using these ideal diodes rather than standard diodes for solar electric panel bypass, reverse-battery protection, or bridge rectifiers reduces the amount of power dissipated in the diodes, improving efficiency and reducing the size of the circuit board and the weight of the heat sink required to deal with the power dissipation.