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Piranha solution is used frequently in the microelectronics industry, e.g. to clean photoresist or organic material residue from silicon wafers. It is also widely employed in wet etching of wafers in the semiconductor fabrication process .
The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.
Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
Sulfuric acid-peroxide mixture (a.k.a. Piranha) removes organics. Hydrogen fluoride removes native oxide from silicon surface. These are all wet cleaning steps in solutions. Dry cleaning methods include oxygen and argon plasma treatments to remove unwanted surface layers, or hydrogen bake at elevated temperature to remove native oxide before ...
Cleaning by solvents such as acetone, trichloroethylene or ultrapure water sometimes while spinning the wafer; Piranha solution; RCA clean; Wafer scrubbing; Spin cleaning [119] Jet spray cleaning [119] Cryogenic aerosol [120] Megasonics [121] Immersion batch cleaning [122] Surface passivation; Photolithography. Photoresist coating (often as a ...
The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [17] The adhesion promoter with a specific thickness is deposited, i.e. spin-coated or contact printed on the wafer to improve the bonding strength.
The wafer platter is electrically isolated from the rest of the chamber. Gas enters through small inlets in the top of the chamber, and exits to the vacuum pump system through the bottom. The types and amount of gas used vary depending upon the etch process; for instance, sulfur hexafluoride is commonly used for etching silicon.
The silicon wafers start out blank and pure. The circuits are built in layers in clean rooms. First, photoresist patterns are photo-masked in micrometer detail onto the wafers' surface. The wafers are then exposed to short-wave ultraviolet light and the unexposed areas are thus etched away and cleaned.