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  2. MIL-STD-883 - Wikipedia

    en.wikipedia.org/wiki/MIL-STD-883

    The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and ...

  3. Pull off test - Wikipedia

    en.wikipedia.org/wiki/Pull_off_test

    MIL-STD-883 methods 2011.9 destructive bond pull test [1] and 2031.1 flip chip pull off test [2] apply, as well as JEDEC JESD22-B109. Partial coring may be used, if necessary, to eliminate surface skin effects.

  4. United States Military Standard - Wikipedia

    en.wikipedia.org/wiki/United_States_Military...

    MIL-STD-810, test methods for determining the environmental effects on equipment [24] MIL-STD-882, standard practice for system safety [25] MIL-STD-883, test method standard for microcircuits [26] MIL-STD-1168, a classification system for ammunition production that replaced the Ammunition Identification Code (AIC) system used during World War II.

  5. Environmental stress screening - Wikipedia

    en.wikipedia.org/wiki/Environmental_stress_screening

    Method: Per Mil-Std-810G for LRUs and SRUs, per Mil-Std-202G for electronic piece parts, per Mil-Std-1540 for space systems, and per Mil-Std-883H for microelectronic devices. EMI/RFI Testing is usually included in ESS Qualification Testing and requires application of MIL-STD 461E. These Military Standards require tailoring.

  6. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    The dip and look method is a qualitative test. One form of it is specified as Mil-Std-883 Method 2003. On the other hand, the wetting balance analysis is a quantitative test that measures the wetting forces between molten solder and the test surface as a function of time.

  7. Flatpack (electronics) - Wikipedia

    en.wikipedia.org/wiki/Flatpack_(electronics)

    The test procedures of these requirements are found in MIL-STD-883 (Test Methods and Procedures for Microelectronics) as a listing of test methods. These methods cover various aspects of the minimum requirements that a microelectronics device must be able to attain before it is considered a compliant device.

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    www.aol.com/list-proves-almost-anything-air...

    This new method for cooking bacon means that you can make all your favorite bacon recipes a whole lot better for you! Get the Air Fryer Bacon recipe. C. W. Newell. Air Fryer Egg Rolls.

  9. MIL-PRF-38535 - Wikipedia

    en.wikipedia.org/wiki/MIL-PRF-38535

    For QML microcircuits the manufacturer developed a program plan that meets the performance detailed in these appendices. Appendix A is mandatory for manufacturers of device types supplied in compliance with MIL-STD-883 and forms the basis for QML classes Q and V. Appendix B is intended for space application and is required for V level devices ...