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Articles with the IC number in the title use [[Category:IC objects|####]], dropping the IC prefix, and using only the number. The number should be padded up to 4 digits using zeroes. Articles without the IC number in the title use [[Category:IC objects]]. A redirect containing the IC number should also be added to the category, sorted as above.
The following is a list of LM-series integrated circuits. Many were among the first analog integrated circuits commercially produced since late 1965; [1] some were groundbreaking innovations [opinion]. As of 2007, many are still being used. [2] The LM series originated with integrated circuits made by National Semiconductor.
CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate. A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system.
العربية; Aragonés; Azərbaycanca; বাংলা; Беларуская; Беларуская (тарашкевіца) Български; Català
Typical SoC use in a system on a module circuit board SoM block diagram example. A system on a module (SoM) is a board-level circuit that integrates a system function in a single module. It may integrate digital and analog functions on a single board.
A floppy-disk controller (FDC) is a hardware component that directs and controls reading from and writing to a computer's floppy disk drive (FDD). It has evolved from a discrete set of components on one or more circuit boards to a special-purpose integrated circuit (IC or "chip") or a component thereof.
IC programming [1] is the process of transferring a software or firmware into an integrated circuit (IC), typically to enable the chip to perform specific tasks or functions. The process of IC programming usually requires an IC programmer, also known as a chip programmer, device programmer, or PROM writer, which is an electronic device used to ...
more than Moore – a catch-all phrase for technologies that attempt to bypass Moore’s Law, creating smaller, faster, or more powerful ICs without shrinking the size of the transistor; multi-chip module (MCM) – an electronic assembly integrating multiple ICs, dies, chiplets, etc. onto a unifying substrate so that they can be treated as one IC