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A thermocouple, also known as a "thermoelectrical thermometer", is an electrical device consisting of two dissimilar electrical conductors forming an electrical junction.A thermocouple produces a temperature-dependent voltage as a result of the Seebeck effect, and this voltage can be interpreted to measure temperature.
Failure mode and effects analysis (FMEA; often written with "failure modes" in plural) is the process of reviewing as many components, assemblies, and subsystems as possible to identify potential failure modes in a system and their causes and effects. For each component, the failure modes and their resulting effects on the rest of the system ...
Failure mode effects and criticality analysis (FMECA) is an extension of failure mode and effects analysis (FMEA). FMEA is a bottom-up , inductive analytical method which may be performed at either the functional or piece-part level.
The first piece of information added in an FMEDA is the quantitative failure data (failure rates and the distribution of failure modes) for all components being analyzed. The second piece of information added to an FMEDA is the probability of the system or subsystem to detect internal failures via automatic on-line diagnostics.
The best place to start is with the failure mode. This is based on the assumption that there is a particular failure mode, or range of modes, that may occur within a product. It is therefore reasonable to assume that the bond test should replicate the mode, or modes of interest. However, exact replication is not always possible.
Failure modes, effects, and diagnostic analysis (FMEDA) is a systematic analysis technique to obtain subsystem / product level failure rates, failure modes and design strength. The FMEDA technique considers: All components of a design, The functionality of each component, The failure modes of each component,
Thermal shock resistance measures can be used for material selection in applications subject to rapid temperature changes. The maximum temperature jump, , sustainable by a material can be defined for strength-controlled models by: [4] [3] = where is the failure stress (which can be yield or fracture stress), is the coefficient of thermal expansion, is the Young's modulus, and is a constant ...
The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a lifetime test, device life test or extended burn in test and is used to trigger potential failure modes and assess IC lifetime. There are several types of HTOL: