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  2. Processor power dissipation - Wikipedia

    en.wikipedia.org/wiki/Processor_power_dissipation

    Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.

  3. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    The average CPU power (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture (Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for ...

  4. Processor (computing) - Wikipedia

    en.wikipedia.org/wiki/Processor_(computing)

    In computing and computer science, a processor or processing unit is an electrical component ... Multi-core processor; Processor power dissipation; Central processing ...

  5. Run-time estimation of system and sub-system level power ...

    en.wikipedia.org/wiki/Run-time_estimation_of...

    Power models are presented for each of subsystems CPU, memory and disk in reference [18] in detail. This power model is the core technique for Joulemeter. Figure 4 in reference [18] shows the block diagram of Joulemeter where System Resource & Power Tracing module reads the full server CPU, disk and power usage. The VM resource tracking module ...

  6. Dynamic frequency scaling - Wikipedia

    en.wikipedia.org/wiki/Dynamic_frequency_scaling

    The dynamic power (switching power) dissipated by a chip is C·V 2 ·A·f, where C is the capacitance being switched per clock cycle, V is voltage, A is the activity factor [1] indicating the average number of switching events per clock cycle by the transistors in the chip (as a unitless quantity) and f is the clock frequency.

  7. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    The heat can be more efficiently and quickly removed by directly cooling the local hot spots of the chip, within the package. At these locations, power dissipation of over 300 W/cm 2 (typical CPU is less than 100 W/cm 2) can occur, although future systems are expected to exceed 1000 W/cm 2. [44]

  8. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    Thermal resistance is defined as temperature rise per unit of power, analogous to electrical resistance, and is expressed in units of degrees Celsius per watt (°C/W). If the device dissipation in watts is known, and the total thermal resistance is calculated, the temperature rise of the die over the ambient air can be calculated.

  9. Power management - Wikipedia

    en.wikipedia.org/wiki/Power_management

    The power management for microprocessors can be done over the whole processor, or in specific components, such as cache memory and main memory. With dynamic voltage scaling and dynamic frequency scaling , the CPU core voltage , clock rate , or both, can be altered to decrease power consumption at the price of potentially lower performance.