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The statement of Newton's law used in the heat transfer literature puts into mathematics the idea that the rate of heat loss of a body is proportional to the difference in temperatures between the body and its surroundings. For a temperature-independent heat transfer coefficient, the statement is:
The heat transfer coefficient is the heat transferred per unit area per kelvin. Thus area is included in the equation as it represents the area over which the transfer of heat takes place. The areas for each flow will be different as they represent the contact area for each fluid side.
A fan coil unit (FCU), also known as a Vertical Fan Coil Unit (VFCU), is a device consisting of a heat exchanger (coil) and a fan. FCUs are commonly used in HVAC systems of residential, commercial, and industrial buildings that use ducted split air conditioning or central plant cooling.
CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]
This coefficient accounts for the time lag between the outdoor and indoor temperature peaks. Depending on the properties of the building envelope, a delay is present when observing the amount of heat being transferred inside from the outdoors. The CLF is the cooling load at a given time compared to the heat gain from earlier in the day. [1] [5]
Cooling capacity is the measure of a cooling system's ability to remove heat. [1] It is equivalent to the heat supplied to the evaporator/boiler part of the refrigeration cycle and may be called the "rate of refrigeration" or "refrigeration capacity".
Thermodynamic and mechanical heat transfer is calculated with the heat transfer coefficient, the proportionality between the heat flux and the thermodynamic driving force for the flow of heat. Heat flux is a quantitative, vectorial representation of heat flow through a surface. [3]
Heat sinks are devices that are used to extend the surface area of electronic components available for air cooling, helping to lower the components case temperature. Fans are used to increase the air flow. Thermal design and analysis is performed using hand calculations or spreadsheets, based on design rules or heat transfer correlations.