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  2. Laser cutting - Wikipedia

    en.wikipedia.org/wiki/Laser_cutting

    Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...

  3. Laser engraving - Wikipedia

    en.wikipedia.org/wiki/Laser_engraving

    Laser marking on stainless steel A laser engraving machine A laser engraver. A laser engraving machine consists of three main parts: a laser, a controller, and a surface. [2] The laser is a drawing tool: the beam emitted from it allows the controller to trace patterns onto the surface.

  4. Speeds and feeds - Wikipedia

    en.wikipedia.org/wiki/Speeds_and_feeds

    Cutting speed may be defined as the rate at the workpiece surface, irrespective of the machining operation used. A cutting speed for mild steel of 100 ft/min is the same whether it is the speed of the cutter passing over the workpiece, such as in a turning operation, or the speed of the cutter moving past a workpiece, such as in a milling operation.

  5. Selective laser melting - Wikipedia

    en.wikipedia.org/wiki/Selective_laser_melting

    Stainless steel grade 316L is an austenitic iron-based alloy that features a low carbon content (< 0.03%). Tensile tests and creep tests of 316L steel performed at 600 °C and 650 °C concluded that the SLM steel reached the minimum creep rate at significantly lower creep strains, around one decade lower, compared to the wrought counterpart. [34]

  6. Annular cutter - Wikipedia

    en.wikipedia.org/wiki/Annular_cutter

    A tungsten carbide tipped (TCT) and high-speed steel (HSS) annular cutter (also known as a "core drill" or "hole saw"). An annular cutter (also called a core drill, core cutter, broach cutter, trepanning drill, hole saw, or cup-type cutter) is a form of core drill used to create holes in metal.

  7. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

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