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Immersion lithography is a technique used in semiconductor manufacturing to enhance the resolution and accuracy of the lithographic process. It involves using a liquid medium, typically water, between the lens and the wafer during exposure.
This method, called immersion lithography, is the current cutting edge of practical production technology. It works because numerical aperture is a function of the maximum angle of light that can enter the lens and the refractive index of the medium through which the light passes. When water is employed as the medium, it greatly increases ...
High-index immersion lithography is the newest extension of 193 nm lithography to be considered. In 2006, features less than 30 nm were demonstrated by IBM using this technique. [72] These systems used CaF 2 calcium fluoride lenses. [73] [74] Immersion lithography at 157 nm was explored. [75]
Continuous Liquid Interface Production (CLIP; originally Continuous Liquid Interphase Printing) is a proprietary method of 3D printing that uses photo polymerization to create smooth-sided solid objects of a wide variety of shapes using resins.
Multiple patterning with immersion scanners can be expected to have higher wafer productivity than EUV, even with as many as 4 passes per layer, due to faster wafer exposure throughput (WPH), a larger number of tools being available, and higher uptime.
Water transfer printing, also known as immersion printing, water transfer imaging, hydro dipping, watermarbling, cubic printing, Hydrographics, or HydroGraphics, is a method of applying printed designs to three-dimensional surfaces. The resulting combinations may be considered decorative art or applied art. The hydrographic process can be used ...
The emergence of immersion lithography has a strong impact on photomask requirements. The commonly used attenuated phase-shifting mask is more sensitive to the higher incidence angles applied in "hyper-NA" lithography, due to the longer optical path through the patterned film. [15]
Hence, it is commonly used for the origination of master structures for subsequent micro or nano replication processes [4] (e.g. nanoimprint lithography) or for testing photoresist processes for lithography techniques based on new wavelengths (e.g., EUV or 193 nm immersion). In addition, interfering laser beams of high-power pulsed lasers ...