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Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB . [ 1 ] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
A modern example of multi-chip integrated circuit packages would be certain models of microprocessor, which may include separate dies for such things as cache memory within the same package. In a technique called flip chip , digital integrated circuit dies are inverted and soldered to a module carrier, for assembly into large systems. [ 8 ]
Because some modern chips are available only in surface-mount package types, a number of companies sell various prototyping adapters to allow those surface-mount devices (SMD) to be used like DIP devices with through-hole breadboards and soldered prototyping boards (such as stripboard and perfboard). (SMT can pose quite a problem, at least an ...
Some foods, like potato chips, are packaged in a pouch with extra air to preserve the texture and prevent damage. That’s normal. But if an item has swelled beyond its expected size, turning into ...
Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy [3] or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly ...
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